08054C103KAZ9A [KYOCERA AVX]

General Specifications; 一般特定网络阳离子


型号：	08054C103KAZ9A
厂家：	KYOCERA AVX
描述：	General Specifications 一般特定网络阳离子
文件：	总4页 (文件大小：131K)
中文：	中文翻译
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X7R Dielectric

General Specifications

X7R formulations are called “temperature stable” ceramics and

fall into EIA Class II materials. X7R is the most popular of these

intermediate dielectric constant materials. Its temperature varia-

tion of capacitance is within ±±15 from -11°C to +±21°C. This

capacitance change is non-linear.

Capacitance for X7R varies under the influence of electrical op-

erating conditions such as voltage and frequency.

X7R dielectric chip usage covers the broad spectrum of

industrial applications where known changes in capacitance

due to applied voltages are acceptable.

PART NUMBER (see page 2 for complete part number explanation)

0805

103

Size

(L" x W")

Voltage

4V = 4

Dielectric

X7R = C

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

J = ± 15%

Failure

Rate

A = Not

Applicable

Terminations

Packaging

2 = 7" Reel

Special

Code

A = Std.

Product

T = Plated Ni

6.3V = 6

±0V = Z

±6V = Y

21V = 3

10V = 1

±00V = ±

200V = 2

100V = 7

4 = ±3" Reel

7 = Bulk Cass.

9 = Bulk

and Sn

K = ±±05

M = ± 205

7 = Gold Plated%

Z= FLEXITERM^®%%

%≤±μF only,

contact factory for

additional values

Contact

Factory For

Multiples

%Optional termination

%%See FLEXITERM^®

X7R section

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

X7R Dielectric

Insulation Resistance vs Temperature

⌬ Capacitance vs. Frequency

Typical Temperature Coefficient

10,000

1,000

100

+30

+20

+10

-5

-10

-20

-30

-10

-15

-20

-25

100

120

-60 -40

100 140

120

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

-20

20 40 60 80

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7R

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7R

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7R

10.00

1206

0805

1210

1206

0805

1210

1,000 pF

10,000 pF

1.0

0.1

.01

1.00

1.0

0.10

0.01

0.1

.01

100

1,000

100

1000

100

1,000

Frequency, MHz

X7R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7R Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-11ºC to +±21ºC

Within specified tolerance

≤ 2.15 for ≥ 10V DC rating

≤ 3.05 for 21V DC rating

≤ 3.15 for 21V and ±6V DC rating

≤ 1.05 for ≤ ±0V DC rating

±00,000MΩ or ±000MΩ - μF,

whichever is less

Freq.: ±.0 kHz ± ±05

Voltage: ±.0Vrms ± .2V

Dissipation Factor

Charge device with rated voltage for

±20 ± 1 secs ꢀ room temp/humidity

Charge device with 3005 of rated voltage for

±-1 seconds, w/charge and discharge current

limited to 10 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with ±105 of rated

voltage for 100V devices.

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

≤ ±±25

Deflection: 2mm

Test Time: 30 seconds

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

≥ Initial Value x 0.3

Stresses

90 mm

≥ 915 of each terminal should be covered

with fresh solder

No defects, <215 leaching of either end terminal

Dip device in eutectic solder at 230 ± 1ºC

for 1.0 ± 0.1 seconds

Solderability

Appearance

Capacitance

Variation

≤ ±7.15

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

hours before measuring electrical properties.

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

≤ ±7.15

Appearance

Capacitance

Variation

Step ±: -11ºC ± 2º

Step 2: Room Temp

30 ± 3 minutes

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +±21ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

≤ 3 minutes

Repeat for 1 cycles and measure after

24 ± 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with ±.1 rated voltage (≤ ±0V) in

test chamber set at ±21ºC ± 2ºC

for ±000 hours (+48, -0)

≤ ±±2.15

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 ± 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 81ºC ± 2ºC/

815 ± 15 relative humidity for ±000 hours

(+48, -0) with rated voltage applied.

≤ ±±2.15

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 ± 2 hours before measuring.

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0101

0201

0402

0603

0805

1206

Soldering

Packaging

Reflow Only

All Paper

Reflow/Wave

All Paper

Reflow/Wave

All Paper

Reflow/Wave

Paper/Embossed

(in.)

0.40 ± 0.02

0.60 ± 0.03

±.00 ± 0.±0

±.60 ± 0.±1

2.0± ± 0.20

3.20 ± 0.20

(L) Length

(0.0±6 ± 0.0008)

(0.024 ± 0.00±)

(0.040 ± 0.004)

(0.063 ± 0.006)

(0.079 ± 0.008)

(0.±26 ± 0.008)

(in.)

0.20 ± 0.02

(0.008 ± 0.0008)

0.30 ± 0.03

(0.0±± ± 0.00±)

0.10 ± 0.±0

(0.020 ± 0.004)

0.8± ± 0.±1

(0.032 ± 0.006)

±.21 ± 0.20

(0.049 ± 0.008)

±.60 ± 0.20

(0.063 ± 0.008)

(W) Width

(in.)

0.20 ± 0.02

(0.008 ± 0.0008)

0.±1 ± 0.01

(0.006 ± 0.002)

0.21 ± 0.±1

(0.0±0 ± 0.006)

0.31 ± 0.±1

(0.0±4 ± 0.006)

0.10 ± 0.21

(0.020 ± 0.0±0)

0.10 ± 0.21

(0.020 ± 0.0±0)

(t) Terminal

WVDC

±00

±10

220

330

±0

±6

6.3

±0

±6

±00 200 6.3

±0

±6

±00 200 6.3

±0

±6

10 ±00 200 100

Cap

(pF)

470

680

±000

±100

2200

3300

4700

6800

0.0±0

0.0±1

0.022

0.033

0.047

0.068

0.±0

0.±1

0.22

0.33

0.47

0.68

±.0

Cap

(μF

±.1

2.2

3.3

4.7

±0

±00

WVDC

±0

±6

6.3

±0

±6

±00 200 6.3

±0

±6

±00 200 6.3

±0

±6

10 ±00 200 100

SIZE

0101

0201

0402

0603

0805

1206

Letter

Max.

Thickness (0.0±3)

0.33

0.16

(0.022)

0.7±

(0.028)

±.02

(0.040)

±.27

(0.010)

±.40

(0.011)

±.12

(0.060)

2.29

(0.090)

2.14

(0.±00)

2.79

(0.±±0)

0.90

(0.031)

0.94

(0.037)

±.78

(0.070)

PAPER

EMBOSSED

%Optional Specifications – Contact factory

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1210

1812

1825

2220

2225

Soldering

Reflow Only

Packaging

Paper/Embossed

All Embossed

(in.)

3.20 ± 0.20

4.10 ± 0.30

1.70 ± 0.40

1.72 ± 0.21

(L) Length

(0.±26 ± 0.008)

(0.±77 ± 0.0±2)

(0.221 ± 0.0±6)

(0.221 ± 0.0±0)

(in.)

2.10 ± 0.20

(0.098 ± 0.008)

3.20 ± 0.20

(0.±26 ± 0.008)

6.40 ± 0.40

(0.212 ± 0.0±6)

1.00 ± 0.40

(0.±97 ± 0.0±6)

6.31 ± 0.21

(0.210 ± 0.0±0)

(W) Width

(in.)

0.10 ± 0.21

(0.020 ± 0.0±0)

0.6± ± 0.36

(0.024 ± 0.0±4)

0.6± ± 0.36

(0.024 ± 0.0±4)

0.64 ± 0.39

(0.021 ± 0.0±1)

0.64 ± 0.39

(0.021 ± 0.0±1)

(t) Terminal

WVDC

±0

±6

±00

200

100

±00

200

100

±00

200

±00

Cap

(pF)

±00

±10

220

᭢

330

470

᭢

680

±000

±100

2200

3300

4700

6800

0.0±0

0.0±1

0.022

0.033

0.047

0.068

0.±0

0.±1

0.22

0.33

0.47

0.68

±.0

Cap

(μF

±.1

2.2

3.3

4.7

±0

±00

WVDC

±0

±6

±00

200

100

±00

200

100

±00

200

±00

SIZE

1210

1812

1825

2220

2225

Letter

Max.

Thickness (0.0±3)

0.33

0.16

(0.022)

0.7±

(0.028)

0.90

(0.031)

0.94

(0.037)

±.02

(0.040)

±.27

(0.010)

±.40

(0.011)

±.12

(0.060)

±.78

(0.070)

2.29

(0.090)

2.79

(0.±±0)

2.14

(0.±00)

PAPER

EMBOSSED

%Optional Specifications – Contact factory

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